To provide a lead frame for an LED capable of increasing the number of LED chips to be mounted per unit area.
An LED module 1 includes lead frames in which a plurality of pad parts 6b arranged in a direction orthogonal to a pad base part and a plurality of lead parts 7b arranged in a direction orthogonal to a lead base are arranged alternately and in a non-contact manner, facing each other. A reflector 10 is molded by filling a filled resin between the pad parts 6b and the lead parts 7b and formed by the filled resin so as to enclose the plurality of the pad parts and the plurality of the lead parts. A plurality of LED chips 4 are connected in parallel by mounting them on the respective pad parts 6b in the longitudinal direction and connecting a metal wire which supplies electric power to the respective LED chips 4 to the lead parts 7b. The plurality of LED chips 4 and the metal wire in the reflector 10 are sealed by filling a transparent sealing resin.
MANIWA SUSUMU
TODA JUNKO
FUKADA TAKAYUKI
志賀 正武
鈴木 史朗
高橋 詔男