To provide a lead frame substrate for an LED light emitting element which enhances heat radiation performance for driving heat generated from the LED light emitting element and heat generated due to environmental conditions despite its small size.
A lead frame substrate 10 for an LED light emitting element of this invention includes: a resin molded body 11 having one or more recessed part 12 on a first surface; and a lead frame 50 having a pad part 13 which is provided on a bottom surface of the recessed part and is used for mounting at least one LED light emitting element 20 and a lead part 14 for electrically connecting with the LED light emitting element. Irregularities are formed on a surface of the lead frame which is the opposite side of a surface where the recessed part is formed.
MANIWA SUSUMU
TODA JUNKO
FUKADA TAKAYUKI
志賀 正武
鈴木 史朗
高橋 詔男
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