Title:
発光素子パッケージ及びこれを含む照明装置
Document Type and Number:
Japanese Patent JP6810927
Kind Code:
B2
Abstract:
Disclosed are a light emitting device package (100) and a lighting apparatus. The light emitting device package (100) includes a substrate (110), a light emitting structure (120) disposed under the substrate (110) and including a first conductive type semiconductor layer (122), an active layer (124), and a second conductive type semiconductor layer (126), a first electrode (132-1, 132-2) connected to the first conductive type semiconductor layer (122) exposed through at least one contact hole (CH-1, CH-2), a second electrode (134) connected to the second conductive type semiconductor layer (126), a first insulating layer (140) configured to extend from under the light emitting structure (120) to a space between a side of the light emitting structure (120) and the first electrode (132-1, 132-2) and configured to reflect light, and a reflective layer (150) disposed under the first insulating layer (140).
Inventors:
Junho, Seungho
Im, bunjin
Lee, Sanyoru
Im, bunjin
Lee, Sanyoru
Application Number:
JP2016034334A
Publication Date:
January 13, 2021
Filing Date:
February 25, 2016
Export Citation:
Assignee:
LG Innotek Co., Ltd
International Classes:
H01L33/10; H01L33/00; H01L33/38; H01L33/44; H01L33/46; H01L33/62
Foreign References:
| US20120074441 | ||||
| KR1020130011575A | ||||
| US20150008465 | ||||
| US20140160754 | ||||
| KR1020130139630A |
Attorney, Agent or Firm:
Makoto Ono
Kenkyo Kanayama
Kazuki Shigemori
Hidehiko Ichikawa
Yoshikazu Iwase
Kenkyo Kanayama
Kazuki Shigemori
Hidehiko Ichikawa
Yoshikazu Iwase