To provide a liquid state resin composition excellent in working property by having a low viscosity, showing a good close adhesion and also having a low elastic modulus, and a semiconductor device excellent in reliability such as a solder crack resistance, etc., by using the liquid state resin composition as a die attach material for the semiconductor or an adhesive for its heat radiating member.

This liquid state resin composition for bonding the semiconductor element or its heat radiation member with a supporting material includes (A) a filler, (B) a thermosetting resin consisting only of a compound having 2 same kinds of functional groups in one molecule, (C) a curing catalyst and (D) an additive as essential components.