Title:
モジュール式フレーム用の位置決めピンアセンブリ
Document Type and Number:
Japanese Patent JP7421540
Kind Code:
B2
Abstract:
A locating pin assembly for coupling a first modular frame to a second modular frame is disclosed. The locating pin assembly has a first gusset plate positioned between the first modular frame and the second modular frame. The first gusset plate has a first gusset plate aperture and a second gusset plate aperture for receiving fastening means for coupling the first-modular-frame-first-beam and the second-modular-frame-first-beam the gusset plate. The pin assembly also has a pin engaging the first gusset plate, the first modular frame and the second modular frame. Also disclosed are modular frame units having the pin assembly, system of modular frame units having the pin assembly and a method of coupling modular frame units.
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Inventors:
Boron, Julian
Application Number:
JP2021500562A
Publication Date:
January 24, 2024
Filing Date:
July 12, 2019
Export Citation:
Assignee:
Z-Modular Holding, Incorporated
International Classes:
E04B1/348; F16B7/18
Domestic Patent References:
JP2016513192A | ||||
JP5195584A | ||||
JP2013245501A | ||||
JP3233042A | ||||
JP2017515027A | ||||
JP7300901A |
Foreign References:
CN104612250A | ||||
WO2017027965A1 | ||||
EP2818429A1 | ||||
US20190136504 |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito