PURPOSE: To simplify the processes, improve the yield, reliability and characteristics and facilitate cost savings by a method wherein a long device array part and a wiring part are provided and electric contact parts of the respective functional devices and the corresponding wirings are connected together by wire bonding in the manner of matrix wiring.
CONSTITUTION: A wiring board 11 is composed of an insulating substrate 7 and a wiring part which is formed by patterning a layer of a conductive film 12, formed on the substrate 7, into required form. The wiring part is composed of bonding pads 6 and the wirings 13. The respective functional devices in a long device array board 10 are electrically connected to the corresponding wirings 13 in the wiring board 11 with wires 9 by wire bonding. For instance, the individual functional devices in the long device array board 10 are connected to the corresponding wires and the wirings 13 and the wires 9 constitute a matrix wiring parts. Therefore, by utilizing the wire 9 as a part of the matrix wiring positively, the matrix wiring can be obtained with the combination of the device array board 10 and the wiring board 11 of the simple wiring structure.
HITOTSUBASHI HIROO
KOMIYAMA KATSUMI
MURATA MASAYOSHI
ITABASHI SATORU
TERADA KATSUNORI
KODAMA HIROMI
SUZUKI HIDEYUKI
MORIMOTO KENJI
SHIMADA TETSUYA
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