To provide the looping adjusting method of a wire bonding device with which loop height can be adjusted coordinatingly and also adjusting manhours can be reduced.

This wire bonding device is used to house the data of the moving path of a capillary, which moves to the second bonding point B2 from the first bonding point B1, in the memory, etc., of a controller as the control data of the capillary. The changing amount of the looping height H of a wire 3 against the changing amount of rising height T1 and horizontal moving distance T2 is housed in advance in the memory, etc., of the controller as a data table, the deviation between the actual looping height H, when looping is conducted and the target loop height is computed, the rising height T1, from which target loop height can be obtained from the data table based on the above-mentioned deviation, and the horizontal moving distance T2 are detected, and locus data is re-written.