To speed up the wire bonding operation in the wire bonding of an aluminum wire.
After the tip part of a bonding wire W has been bent by a wire bending mechanism to the direction different from the direction where the bonding pads, provided on a semiconductor chip, are lined up, a wire bonding operation is conducted using a capillary 3. For example, when the bonding pad is provided in lateral direction to the main surface of the semiconductor chip and the bonding wire W is bent in longitudinal direction, the wire bar 6b, with which the bonding wire W is bent, moves to longitudinal direction by a wire bar driving part, a bonding operation is conducted after preventing the contact of the bonding pad, with which the bonding wire W, protruding from the capillary 3, is bent in longitudinal direction and adjacently located, and the top part of the bent bonding wire W.
MATSUNAGA TOSHIHIRO
HIDA AKIHIRO
SHIRAISHI TOMOHIRO
KUBOSONO MINORU
KURODA HIROSHI
SHIRAI MASAYUKI
