Title:
A solder vamp's manufacturing method
Document Type and Number:
Japanese Patent JP6111584
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for producing a solder bump which suppresses the generation of needle-like projections.SOLUTION: In the method for producing a solder bump by a reflow process of a solder paste in which a bump solder alloy powder having a component composition containing 2.8-4.2 wt.% of Ag, 0.4-0.6 wt.% of Cu, and remnants of Sn and unavoidable impurities is mixed with flux, the reflow process comprises a first reflow step of performing heating at a temperature higher than the melting point of the bump solder alloy powder to form a prototype of a solder bump, and a second reflow step of performing heating at a temperature higher than the melting point of the solder alloy bump to adjust the shape of the solder bump, and the second reflow step satisfies all of a maximum temperature being 240°C or more, a duration of temperature being 217°C or more remaining the solder bump molten 35 sec. or more and a rate of cooling from the maximum temperature to 150°C 3.5°C/sec. or more.
More Like This:
Inventors:
Masayuki Ishikawa
Takashi Yamaji
Hiroki Uno
Takashi Yamaji
Hiroki Uno
Application Number:
JP2012219372A
Publication Date:
April 12, 2017
Filing Date:
October 01, 2012
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
H01L21/60; B23K35/22; B23K35/26
Domestic Patent References:
| JP2002280417A | ||||
| JP2003218152A | ||||
| JP4125932A | ||||
| JP2003324124A | ||||
| JP1051122A | ||||
| JP9148333A |
Foreign References:
| WO2006134891A1 |
Attorney, Agent or Firm:
Hideyuki Sugiura