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Patent Searching and Data


Title:
LOW-CONTAMINATION IMPACT TOOL FOR BREAKING SILICON
Document Type and Number:
Japanese Patent JPH06218677
Kind Code:
A
Abstract:

PURPOSE: To break silicon of semiconductor-grade into pieces without contaminating silicon by comprising a core forming a handle part and a head part, mounting a tungsten carbide striking element contacted with the head part of the core, and coating the core with a synthetic resin outer shell.

CONSTITUTION: This striking tool comprises a core made out of metal, alloy, plastic or composite having the rigidity and strength sufficient for giving the impact to a surface, and having a handle part 1 and a head part 2. A striking element 4 made of tungsten, carbide alloy is contacted and fixed to the head part 2, and the core is totally coated by a cover 3 made of a synthetic resin such as urethane and the like in a state that a striking surface 5 side of the striking element 4 is partially exposed. By coating the surface excluding the striking surface with a low-contamination rigid resin, and forming the striking element 4 out of a low-contamination material, a semiconductor such as silicon and the like can be broken into pieces without contaminating the same.


Inventors:
DANIERU PATORITSUKU RAISU
ERUDON EMERII RUURIGU
JIYON DEII NEMESU
KURISU TEIMU SHIYUMITSUTO
Application Number:
JP28593592A
Publication Date:
August 09, 1994
Filing Date:
October 23, 1992
Export Citation:
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Assignee:
HEMLOCK SEMICONDUCTOR CORP
International Classes:
B25D1/02; H01L21/301; (IPC1-7): B25D1/10; H01L21/78
Attorney, Agent or Firm:
Warren G. Simor