Title:
LOW MOISTURE-ABSORPTIVE POLYAMIDE COMPOSITION
Document Type and Number:
Japanese Patent JP2011057976
Kind Code:
A
Abstract:
To provide a polyamide composition excellent in rigidity, heat resistance, a high melting point, flowability, toughness, and a low moisture-absorption property, and further excellent in mold releasability at molding.
The polyamide composition contains (A) a polyamide obtained by polymerizing (a) a dicarboxylic acid containing at least 50 mol% of an aliphatic dicarboxylic acid with (b) a diamine containing at least 50 mol% of a diamine having a substituent branched from the main chain, and (B) a liquid crystal polyester.
Inventors:
TERADA KAZUNORI
KURIHARA TETSUO
KURIHARA TETSUO
Application Number:
JP2010178870A
Publication Date:
March 24, 2011
Filing Date:
August 09, 2010
Export Citation:
Assignee:
ASAHI KASEI CHEMICALS CORP
International Classes:
C08L77/06; C08G69/26; C08K3/00; C08K7/04; C08L67/00
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Kazuhiko Naito
Toshifumi Onuki
Kazuhiko Naito
Previous Patent: POLYAMIDE COMPOSITION
Next Patent: POLYAMIDE RESIN COMPOSITION EXCELLENT IN WEATHERABILITY AND METHOD FOR PRODUCING THE SAME
Next Patent: POLYAMIDE RESIN COMPOSITION EXCELLENT IN WEATHERABILITY AND METHOD FOR PRODUCING THE SAME