PURPOSE: To obtain a suitable electronic material having strength and conductivity by degreasing a Cu-Al alloy stock and then annealing the above stock at a temp. in a specific temp. range in an atmosphere of a partial pressure of oxygen in a specific range.

CONSTITUTION: A Cu-Al alloy stock which contains 0.03W0.3wt.% Al and in which sheet thickness or wire diameter is regulated to 0.05W1mm is degreased and then annealed in an atmosphere of 10-3W10-6atm partial pressure of oxygen at a temp. in a range of 750W950°C. By this method, a copper alloy material free from formation of surface oxide film and having sufficient heat-resisting strength and high conductivity can be obtained at a low cost.