PURPOSE: To provide a method for easily manufacturing a curved circuit board wherein a circuit formed of metallic foil is provided on a curved surface without requiring a conductive paste and curved surface print method for circuit formation.

CONSTITUTION: A manufacturing method of a curved circuit board which is formed of a resin impregnated base material and a circuit formed on its surface and which is formed by laminating a substrate 1 wherein resin of the resin impregnated base material is cured not to have flowability in a following formation process and an uncured resin impregnated base material 2 wherein resin flows to show adhesion in a following formation process and by pressurizing and heating for formation by dies 5, 6 whose pressurizing surface is curved.