PURPOSE: To provide an FPC supporting lamination board which enables good adhesion with a polyimide film which is a base film of a flexible printed circuit board(FPC) (and prevents sticking at a part coated with no adhesive) without carrying out following roughening treatment.
CONSTITUTION: A roughened surface of a diacetate film whose one surface is roughened is laminated on one surface of a prepreg constituent body and a polypropylene film which is not roughened is put on the other surface of the prepreg constituent body. They are heated, pressurized and molded to from a lamination board. After two kinds of films are peeled off from a lamination board, an FPC and a diacetate film peeling surface of a lamination board are laminated with adhesive therebetween. After heating, pressurizing and molding, a lamination board is stuck to an FPC as a supporting board. Sticking is hard to generate at a part coated with no adhesive.
KAMATA MITSUTOSHI
KARIYA KENICHI
