PURPOSE: To prevent sealer from overflowing from a resist layer to an outside and to ensure reinforcement and insulation of a chip part by providing a second resist layer formed on a first resist layer with a cut-out hole which is larger than a cut-out hole of the first resist layer.
CONSTITUTION: A second resist layer 14 formed on a first resist layer 13 is provided with a cut-out hole 14a which is a size larger than a cut-out hole 13a of the first resist layer 13. According to this constitution, when conductive adhesive 16 connecting a terminal part of a chip part 15 and junction parts 12a, 12b of a wiring layer 12 is covered with sealer 17, the sealer 17 stands inside the cut-out hole 14a of the second resist layer 14 and does not overflow from the cut-out hole 14a of the second resist layer 14 even if the sealer 17 overflows from an inside of the cut-out hole 13a of the first resist layer 13 to an outside. Therefore, a terminal part of the chip part 15 and the conductive adhesive 16 are surely covered with the sealer 17 and reinforcement and insulation of a connection part thereof can be ensured.
SHINOHARA YASUHIKO
NAITO SHINGO
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