PURPOSE: To easily automate a soldering process of a printed board with a lead frame requiring most of the man-hours by printing cream solder on the board, placing the frame together with components thereon, soldering the components to the frame in a reflow furnace, dividing the board, and then molding it.

CONSTITUTION: A cream solder 3 is printed on a printed board 1, a lead frame 5 is placed together with components 4L, 4C such as a coil and a capacitor and the like on the board 1 with printed solder 3, and the components 4L, 4C are soldered to the frame 5 in a reflow furnace. Then, after the board 1 in which the components 4L, 4C are soldered to the frame 5 is divided 6, they are molded, and pins of the frame 5 are shaped. Thus, a soldering process of the board which has been heretofore required for the most of the man-hours so far to the frame can be easily automated to largely improve productivity of a LC hybrid element.