Title:
MANUFACTURE OF MULTILAYER CHIP PART
Document Type and Number:
Japanese Patent JPH0869943
Kind Code:
A
Abstract:
PURPOSE: To provide a method for manufacturing a multilayer chip part by which the deterioration of insulating resistance by a plating solution and the occurrence of delamination can be suppressed without generating micro cracks processing strain on the surface of a multilayer chip and the chipping of the chip part can be prevented.
CONSTITUTION: By chamfering a divided multilayer chip part before sending the chip part to a binder removing process and baking process, a chipping-free multilayer chip part is obtained without generating any micro crack nor processing strain on the surface of backed chip part.
Inventors:
UENO TORU
IWATA SHINICHI
YONETAKE NAOTO
IWATA SHINICHI
YONETAKE NAOTO
Application Number:
JP22890994A
Publication Date:
March 12, 1996
Filing Date:
August 29, 1994
Export Citation:
Assignee:
TOKIN CORP
International Classes:
B24B31/02; H01G4/12; (IPC1-7): H01G4/12; H01G4/12