PURPOSE: To prevent a conductor pattern from being brought into contact with a glass cloth and to improve migration resistance by forming an insulating layer on the surface of an inner layer conductor pattern before adhering, and then adhering it.

CONSTITUTION: An inner layer core 3 is formed on a conductor pattern 2, an insulating layer 4 is formed on the surface, and an inner layer core 5 with an insulating coating is formed. The core 5 is adhered through a prepreg 6. With this structure, the contact of the pattern with the glass cloth of the prepreg can be prevented by heating and pressurizing at the time of adhering, thereby obtaining a multilayer printed circuit board in which migration is prevented.