Title:
METHOD OF LAMINATING MULTILAYER PRINTED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JPS5578599
Kind Code:
A
More Like This:
Inventors:
KUROSAWA KEIJI
YAMASHITA MITSUO
IMURA TAKAYOSHI
MIYAGAWA KIYOTAKA
YAMAMOTO KENJI
YAMASHITA MITSUO
IMURA TAKAYOSHI
MIYAGAWA KIYOTAKA
YAMAMOTO KENJI
Application Number:
JP15199178A
Publication Date:
June 13, 1980
Filing Date:
December 11, 1978
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H05K3/46; B32B15/08; (IPC1-7): B32B15/08; H05K3/46
Previous Patent: 新規な芳香環水酸化酵素及びその遺伝子
Next Patent: ELECTRONIC PART SERIES AND METHOD OF FABRICATING SAME
Next Patent: ELECTRONIC PART SERIES AND METHOD OF FABRICATING SAME