Title:
MANUFACTURE OF PRINTED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JPH10150073
Kind Code:
A
Abstract:
To provide a printed circuit board on which surface mounting parts of a flip chip type can be mounted through anisotropic conductive film with a high mounting density.
Input/output pads as terminals are formed on one major surface 1a of a bare chip 1, a surface mounting part 3 having bumps 2a and 2b provided thereon is mounted on a print circuit board 4 through an anisotropic conductive film 8 containing conductive particles 7 dispersed into thermosetting resin 6. At this time, outer peripheral edges 8a and 8b are previously thermally set.
Inventors:
YASUDA MASAYUKI
Application Number:
JP30515296A
Publication Date:
June 02, 1998
Filing Date:
November 15, 1996
Export Citation:
Assignee:
SONY CORP
International Classes:
H01L21/60; H05K3/32; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Akira Koike (2 outside)
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