SEMICONDUCTOR DEVICE AND LEAD FRAME FOR THE DEVICE

Title:

SEMICONDUCTOR DEVICE AND LEAD FRAME FOR THE DEVICE

Document Type and Number:

Japanese Patent JPH10150072

Kind Code:

A

Abstract:

To provide a semiconductor device which can improve a connection reliability to solder bumps as external terminals and manufacturing productivity.

Insulating tape 3 having a wiring pattern 4 provided thereon is bonded to a lead frame, semiconductor elements 1 are mounted thereon, and then circuit formation surfaces and side faces of the elements 1 are sealed with sealing resin 7. After formation of such individual semiconductor devices, next, the lead frame is divided into individual metal plates 6 to obtain individual semiconductor devices. Since a plurality of semiconductor devices can be simultaneously manufactured in this way, its productivity can be improved, flatness of the tape 3 can be improved, and connecting reliability to solder bumps 8 can be improved.

Inventors:

KITANO MAKOTO
YAGUCHI AKIHIRO
TANAKA TADAYOSHI
TERASAKI TAKESHI
ANJO ICHIRO
HARUTA AKIRA
NISHIMURA ASAO
SAEKI JUNICHI

Application Number:

JP30956696A

Publication Date:

June 02, 1998

Filing Date:

November 20, 1996

Export Citation:

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Assignee:

HITACHI LTD

International Classes:

H01L23/12; H01L21/60; H01L23/00; H01L23/02; H01L23/16; H01L23/31; H01L23/488; H01L23/495; H01L23/498; H05K3/34; (IPC1-7): H01L21/60; H01L21/60

Attorney, Agent or Firm:

Kasuga

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