To make the positioning of a film carrier higher accurate and to prevent the position deviation in bonding by bonding the tip part of an inner lead and a bump by using a bonding tool after the position of the tip part of the inner lead and the position of the bump are aligned in two dimensions.

After a film carrier 1 is fixed to a clamper 25, the tip part of an inner lead 3 of the film carrier 1 and a bump on a semiconductor chip undergo position alignment in two dimensions directly by using an automatic position detector. Then, the correcting amount for achieving the coincidence of the tip part of the inner lead 3 and the bump on the semiconductor chip is computed in two dimensions. Then, a chip stage unit 24 is moved in two dimensions based on the correcting amount. The tip part of the inner lead 3 and the bump on the semiconductor chip are bonded by a bonding tool. Thus, the positioning of the film carrier 1 can be performed with high accuracy, and the yield can be improved.