PURPOSE: To obtain a thin resin sealed semiconductor device through transfer molding where the diameter of channel is limited in a metal mold or a package by admixing the sealing resin with specified vol.% of filler comprising a specific pts.wt. of filler having specified average particle size and a specified pts.wt. of filler having different average particle size.
CONSTITUTION: A semiconductor device is sealed with a resin admixed with a tiller using a metal mold having a minimum gap of 50-100μm with respect to a semiconductor chip or a lead frame mounting the semiconductor chip. In particular, the sealing resin is admixed with 40-90vol.% of a filter composed of 70-95 pts.wt. of a filler having average particle size of 5-10μm containing 2wt.% or less of rough particles having maximum particle size larger than 50μm and 30-5 pts.wt. of a tiller having average particle size of 0.5-3μm. 'This method allows manufacture of a thin or ultrathin resin sealed semiconductor device excellent in which the molding resin composition has high filling factor and voids and defects are suppressed while eliminating burr.
OGATA MASAJI
ISHII TOSHIAKI
KOKADO HIROYOSHI
MOGI AKIRA
