Title:
MANUFACTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS5313363
Kind Code:
A
Abstract:
PURPOSE: A mold base is made of copper or copper alloy, hte part except a cavity block fixing surface is covered with adiabatic materials, thereby saving the pwoer and eliminating temperature nonuniformity.
Inventors:
INEYA NOBUAKI
TSUNEHIRO TOSHIKATSU
TSUNEHIRO TOSHIKATSU
Application Number:
JP8750176A
Publication Date:
February 06, 1978
Filing Date:
July 22, 1976
Export Citation:
Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
H01L21/56; H01L23/08; (IPC1-7): H01L23/08