MANUFACTURING METHOD OF CIRCUIT DEVICE

Japanese Patent JP3600133

B2

PROBLEM TO BE SOLVED: To solve the problem of the manufacturing method of high mass production not being established in the case that a circuit device in which a circuit element is mounted as a support board such as a ceramic board and a flexible sheet is miniaturized and thinned.
SOLUTION: After a conductive pattern 51 every block 62 is formed, the circuit element is mounted, molded by an insulation resin 50, and the rear face of a conductive foil 60 is etched to form the conductive pattern 51 every block. Each block is taken out in the state that it is connected to a connection part 90 after etching completion by selectively performing the etching of the rear face of the conductive foil 60 on an area 9 providing the conductive pattern of each block, and the manufacturing method of the circuit device suitable for mass production in extreme resource saving can be realized.

Noriaki Sakamoto
Yoshiyuki Kobayashi
Junji Sakamoto
Yukio Okada
Yusuke Igarashi
Eiju Maehara
Koji Takahashi

JP2000266751A

December 08, 2004

September 04, 2000

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Sanyo Electric Co., Ltd.

H01L23/28; H01L21/56; H01L23/12; H01L25/00; H05K3/00; H05K3/06; H05K3/08; H05K3/20; H05K3/24; (IPC1-7): H01L23/12; H01L21/56; H01L23/28; H01L25/00; H05K3/00; H05K3/06; H05K3/08; H05K3/20; H05K3/24

JP11195733A
JP11074296A
JP2000025074A
JP200022044A
JP11251505A
JP2000150760A
JP10313082A
JP9312355A
JP200124135A

Takashi Okada
Katsuhiko Sudo

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