Title:
電磁波シールドシート、プリント配線板およびプリント配線板の製造方法
Document Type and Number:
Japanese Patent JP6645484
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an electromagnetic wave shielding sheet which is excellent in plating solution resistance, solder reflow resistance and repulsive force, and connection reliability after bending, and further exhibits a high electromagnetic wave shielding property even in use in a high frequency transmission circuit.SOLUTION: The electromagnetic wave shielding sheet comprises an insulator layer, a metal layer, and a conductive adhesive layer. The metal layer has 100 to 200000 openings per square centimeter each having an area of 0.7 to 5000 μm. In the openings in the metal layer, w obtained from mathematical formula (1) is from 0.8 to 2.2.SELECTED DRAWING: Figure 1
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Inventors:
Tsutomu Hayasaka
Takahiro Matsuzawa
Takahiro Matsuzawa
Application Number:
JP2017161889A
Publication Date:
February 14, 2020
Filing Date:
August 25, 2017
Export Citation:
Assignee:
Toyo Ink sc Holdings Co., Ltd.
Toyochem Co., Ltd.
Toyochem Co., Ltd.
International Classes:
H05K9/00; B32B3/24; B32B15/04; H05K1/02
Domestic Patent References:
JP2007149761A | ||||
JP2016132251A | ||||
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Foreign References:
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CN101772996A |
Attorney, Agent or Firm:
Ken Ieiri
Keiko Hata
Keiko Hata