Title:
電子回路モジュールの製造方法
Document Type and Number:
Japanese Patent JP6631748
Kind Code:
B2
Abstract:
A manufacturing method including mounting a ceramic plate on a circuit board such that the ceramic plate can be prevented from falling over. An electronic circuit module manufacturing method includes mounting a ceramic plate including a resin layer on a principal surface of a circuit board in such a manner that a principal surface of the ceramic plate is perpendicular or substantially perpendicular to the principal surface of the circuit board, and removing the resin layer from the principal surface of the ceramic plate mounted on the circuit board. In the step of mounting, the ceramic plate is supported by the resin layer and is thus prevented from falling over.
Inventors:
矢▲崎▼ 浩和
Application Number:
JP2019517583A
Publication Date:
January 15, 2020
Filing Date:
May 01, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H05K9/00; C04B41/83; C04B41/88; C04B41/90; C04B41/91; H01L23/12
Domestic Patent References:
| JP60144239U | ||||
| JP2005317935A | ||||
| JP2000294975A | ||||
| JP2011119601A |
Attorney, Agent or Firm:
Nao Kawamoto