To provide a manufacturing method of an electronic device which wiring-connects a connection terminal with an electrode pad without forming a via-hole at a sealing resin on the connection terminal of an electronic component by using a laser.
In the manufacturing method of the electronic device 1, the electronic component 3 equipped with the connection terminal 31 is arranged on a wiring board 2, an electrode pad 4 is disposed on a connection pad 21 on the board, and the electrode pad 4 is sealed with a first sealing resin 5 so that the electronic component 3 is not sealed. The electronic component 3 and the electrode pad 4 sealed with the first sealing resin 5 are sealed with a second sealing resin 6, and a resin sealing package 7 is formed. The via-hole communicating with the electrode pad 4 is formed at the package and the second sealing resin 6 at the upper layer of the package is removed so as to expose a connection terminal 31. Wiring 9 connecting the electrode pad 4 with the connection terminal 31 via the via-hole 8 is formed. A content of the filler in the second sealing resin 6 is lower than that of the first sealing resin 5.
Horimai Kazuharu
Takashi Okamura
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