Title:
発光装置の製造方法、レーザモジュールの製造方法及び発光装置
Document Type and Number:
Japanese Patent JP6665666
Kind Code:
B2
Abstract:
A method for manufacturing a light-emitting device includes: providing a base including a first depressed portion and a second depressed portion both upwardly opening; and positioning and mounting at least one semiconductor laser element on or above the base based on a predetermined point on a line connecting the first depressed portion and the second depressed portion in a plan view.
Inventors:
Kiyota Seiji
Eiichiro OKAKU
Eiichiro OKAKU
Application Number:
JP2016090767A
Publication Date:
March 13, 2020
Filing Date:
April 28, 2016
Export Citation:
Assignee:
Nichia Corporation
International Classes:
H01S5/022
Domestic Patent References:
| JP2009081225A | ||||
| JP2003031600A | ||||
| JP2013254889A | ||||
| JP10041636A | ||||
| JP2008015036A | ||||
| JP10031138A |
Attorney, Agent or Firm:
Shinki Global IP Patent Corporation