Title:
マイクロ流路チップの製造方法
Document Type and Number:
Japanese Patent JP7216288
Kind Code:
B2
Abstract:
Disclosed is method of manufacturing a microchannel chip by joining together a resin channel substrate having microchannels formed on at least one side thereof and a resin lid substrate, the method including: a step (A) wherein surface modification treatment is applied on joining surfaces of the channel substrate and the lid substrate; and a step (B) wherein, after the step (A), the joining surfaces of the channel substrate and the lid substrate are mated and the channel substrate and the lid substrate are pressurized under heating via a fluid or an elastic body having a durometer hardness of E20 or less.
Inventors:
Chiba Daido
Kunihito Arai
Taichi Sawaguchi
Koichi Aizawa
Noriyuki Aritome
Kunihito Arai
Taichi Sawaguchi
Koichi Aizawa
Noriyuki Aritome
Application Number:
JP2019509229A
Publication Date:
February 01, 2023
Filing Date:
March 14, 2018
Export Citation:
Assignee:
Zeon Corporation
International Classes:
B81C3/00; B01J19/00; G01N37/00
Domestic Patent References:
| JP2017001119A | ||||
| JP4998462B2 | ||||
| JP2015166127A |
Foreign References:
| US20090074615 |
Attorney, Agent or Firm:
Kenji Sugimura
Mitsutsugu Sugimura
Hayashi Taro Takahashi
Yuta Terashima
Mitsutsugu Sugimura
Hayashi Taro Takahashi
Yuta Terashima