Title:
オプトエレクトロニクス部品の製造方法
Document Type and Number:
Japanese Patent JP5840777
Kind Code:
B2
Abstract:
An optoelectronic component includes a semiconductor layer sequence having an optoelectronically active region; a dielectric layer on the semiconductor layer sequence; and a metal layer on the dielectric layer, wherein an adhesion layer is arranged between the dielectric layer and the metal layer, the adhesion layer being covalently bonded to the dielectric layer and to the metal layer.
Inventors:
Lindberg Gadran
Heppel Lutz
Cheat heli belt
Heppel Lutz
Cheat heli belt
Application Number:
JP2014522053A
Publication Date:
January 06, 2016
Filing Date:
July 23, 2012
Export Citation:
Assignee:
Osram Opto Semiconductors GmbH
International Classes:
H01L33/44; H01L33/36; H01S5/028
Domestic Patent References:
| JP2005302747A | ||||
| JP2003276110A | ||||
| JP2005086147A |
Foreign References:
| US20040245518 |
Other References:
筆井晃正,他3名,Ag薄膜/SiO2層界面へのMPTMS-SAMの導入による密着性の向上 Improved adhesion by introducing MPTMS-SAM at the interface ofAg thin film/SiQz layer,第56回応用物理学関係連合講演会講演予稿集 Vol.2,日本,(社)応用物理学会,2009年 3月30日,p.665
Attorney, Agent or Firm:
Koichi Washida
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