Title:
MANUFACTURING METHOD OF SEMICONDUCTOR WAFER AND THIS KIND OF SEMICONDUCTOR WAFER
Document Type and Number:
Japanese Patent JP2001244221
Kind Code:
A
Abstract:
To provide a manufacturing method of a semiconductor wafer that polishes both surfaces of the semiconductor wafer, and has front and back surfaces and a polished edge.
In this manufacturing method of a semiconductor wafer, the edge of the semiconductor wafer is polished with polishing cloth (a), the front and back surfaces of the semiconductor wafer are simultaneously polished (b), the front and back surfaces and the edge of the semiconductor wafer are completely wetted with a liquid film immediately after the front and back surfaces of the semiconductor wafer are simultaneously polished (c), and then the semiconductor wafer is cleaned for drying (d).
Inventors:
WENSKI GUIDO (DE)
ALTMANN THOMAS (DE)
HEIER GERHARD (DE)
WINKLER WOLFGANG (DE)
WENSKI GUIDO
THOMAS ALTMANN
HEIER GERHARD
WOLFGANG WINKLER
ALTMANN THOMAS (DE)
HEIER GERHARD (DE)
WINKLER WOLFGANG (DE)
WENSKI GUIDO
THOMAS ALTMANN
HEIER GERHARD
WOLFGANG WINKLER
Application Number:
JP2001027357A
Publication Date:
September 07, 2001
Filing Date:
February 02, 2001
Export Citation:
Assignee:
WACKER SILTRONIC HALBLEITERMAT (DE)
WACKER SILTRONIC HALBLEITERMAT (DE)
WACKER SILTRONIC HALBLEITERMAT (DE)
International Classes:
B24B9/06; B24B37/08; C30B33/00; H01L21/302; B24B1/00; H01L21/304; H01L21/306; (IPC1-7): H01L21/304; B24B1/00; B24B37/00
Attorney, Agent or Firm:
Toshio Yano (4 outside)