Title:
MATERIAL FOR FORMING HOLLOW IN ARTICLE AND PROCESS FOR FORMING HOLLOW IN ARTICLE
Document Type and Number:
Japanese Patent JPH1121315
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To obtain a hollow-forming material that can be easily decomposed at a low temperatures even under the atmospheric pressure, has a proper rate of decomposition, leaves nothing when decomposed, does not need consideration of transmitting or not transmitting light and is easy to handle by using a low- temperature decomposable copolymer containing (meth)acrolein structural units as the essential component. SOLUTION: The low-temperature decomposable copolymer used may further contain (meth)acrylic monomer structural units in addition to the (meth)acrolein structural units. Desirable examples of its production process include an emulsion polymerization process and a suspension polymerization process each of which includes polymerization in the presence of water. The amount of the copolymer used is usually at least 50 wt.% based on the entire hollow-forming material. To form a hollow, a material, in which at least a part of the hollow-forming material is embedded is heated to 70 deg.C or above or remove the hollow-forming material. The hollow may be one inside the material or irregularities on the surface of the material. The material is exemplified by one containing a (binder) resin and an inorganic matter such as a filler or a ceramic.
Inventors:
TORIBUCHI HIRONOBU
Application Number:
JP17462797A
Publication Date:
January 26, 1999
Filing Date:
June 30, 1997
Export Citation:
Assignee:
NIPPON CATALYTIC CHEM IND
International Classes:
C08F16/34; C08F20/12; (IPC1-7): C08F16/34; C08F20/12
Attorney, Agent or Firm:
Takehiko Matsumoto
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