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Title:
MEASURING METHOD OF MOUNTING POSITION AND ITS DEVICE IN FLATNESS MEASUREMENT
Document Type and Number:
Japanese Patent JP2005345356
Kind Code:
A
Abstract:

To provide a measuring method and its device capable of measuring simultaneously accuracy of a mounting position on the object surface, when measuring flatness of the object surface formed by an imaging element such as an imaging element surface of a digital camera.

A chart pattern image 2 is emitted from a reference point to a plurality of points on the object surface Oj comprising the imaging element, to thereby form images on a plurality of measuring points set on the object surface, and a reflected image from each point is detected optically-electrically individually at a conjugate point of the reference point respectively, and the flatness of the object surface is measured based on detected values. At that time, the second measuring point used as a reference not interfering with the measuring points is set on the object surface Oj, and the second measuring point is irradiated with spot light, and the accuracy of the mounting position on the object surface Oj is measured based on position data acquired from the imaging element on the object surface Oj by irradiation light.


Inventors:
KOO TAKESHI
Application Number:
JP2004167196A
Publication Date:
December 15, 2005
Filing Date:
June 04, 2004
Export Citation:
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Assignee:
KYORITSU DENKI KK
International Classes:
G01B11/30; (IPC1-7): G01B11/30
Attorney, Agent or Firm:
Morinosuke Higuchi
Yoshikuni Koizumi