Title:
金属-セラミックス接合基板およびその製造方法
Document Type and Number:
Japanese Patent JP4565249
Kind Code:
B2
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Inventors:
Hideyo Koyamauchi
Application Number:
JP2004246606A
Publication Date:
October 20, 2010
Filing Date:
August 26, 2004
Export Citation:
Assignee:
DOWA Metal Tech Co., Ltd.
International Classes:
H01L23/12; B22D19/00; C04B37/02; H05K1/02; H05K3/46
Domestic Patent References:
| JP2003086747A | ||||
| JP2004115337A | ||||
| JP2004105978A | ||||
| JP10093244A | ||||
| JP2001250723A | ||||
| JP2001160682A | ||||
| JP2002283041A |
Attorney, Agent or Firm:
Koichi Okawa