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Title:
METAL COMPOUND HAVING A NEW SKELETON, ITS MANUFACTURING METHOD, DISPERSION LIQUID AND DISPERSION PRODUCT
Document Type and Number:
Japanese Patent JP2006069876
Kind Code:
A
Abstract:

To provide a metal compound having a new molecular structure which is useful as a material for forming a metal oxide film or a chemical adsorption film or the like and which doesn't aggregate in an organic solvent even when pH adjustment is not conducted and no dispersion stabilizer is added, and to provide its manufacturing method, a dispersion liquid useful for forming a metal oxide film and a dispersion product.

The metal compound is characterized in that it spatially has in one molecule a molecular structure including an arrangement where 6 metal atoms are located at apexes of pentagonal pyramid and an arrangement where 5 metal atoms are located at apexes of pentagon, and there are provided its manufacturing method, a dispersion liquid where fine particles of the metal compound are dispersed in an organic solvent, and a dispersion product that is obtained by adding water to the dispersion liquid at 0.1-1.0 times moles of water against the metal compound in the dispersion liquid and by subjecting it to heat treatment.


Inventors:
HIDAKA TOMOYA
FUJITA YOSHITAKA
ONO KAZUO
UEKUSA HIDEHIRO
OHASHI YUJI
Application Number:
JP2004258621A
Publication Date:
March 16, 2006
Filing Date:
September 06, 2004
Export Citation:
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Assignee:
NIPPON SODA CO
TOKYO INST TECH
International Classes:
C01B13/32; C01G23/053
Domestic Patent References:
JP2000086769A2000-03-28
JPH10298769A1998-11-10
JPH01230407A1989-09-13
Foreign References:
WO2004069740A12004-08-19
WO2005012215A12005-02-10
Attorney, Agent or Firm:
Haruhito Oishi