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Title:
METAL COMPOUND, ITS MANUFACTURING METHOD AND CONDUCTOR PASTE
Document Type and Number:
Japanese Patent JP2008106058
Kind Code:
A
Abstract:

To provide a precious metal acetate derivative and its acetilyde compound which do not generate noxious SOx and Cl2 even if used and sintered as a material for a conductor.

Main ligand of this metal compound comprises acetate ion (or carboxylate) or together with an acetilyde, a substituted acetilyde, its oligomer or acetilyde derivatives, and thus contains neither sulfur nor halogen. In addition, since there is no process in which a sulfite is used, no noxious SOx and Cl2 are generated even if ceramic electronic parts are manufactured by producing a conductor paste from the metal compound. This metal compound which generates neither SOx nor Cl2 contributes to the stability of the performance of final products such as ceramic electronic parts. Relaxation of the restriction of the carbon number of the ligand of the metal compound extends the range of the selection of the ligand.


Inventors:
TAKAHASHI YASUTAKA
HARADA AKIO
Application Number:
JP2007252045A
Publication Date:
May 08, 2008
Filing Date:
September 27, 2007
Export Citation:
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Assignee:
DAIKEN KAGAKU KOGYO KK
International Classes:
C07C53/10; C07C5/00; C07C33/042; C07C51/41; C07F15/00; H01L23/14; H05K1/09; H05K3/12
Domestic Patent References:
JPH05186387A1993-07-27
JPH09255458A1997-09-30
JPH06100578A1994-04-12
JPS58162551A1983-09-27
JPS59222497A1984-12-14
JP2006016341A2006-01-19
JPH11158184A1999-06-15
JP2006219461A2006-08-24
Foreign References:
WO1999016773A11999-04-08
Attorney, Agent or Firm:
Hisami Miki