Title:
金属膜研磨スラリー組成物、及びこれを利用した金属膜研磨時に発生するスクラッチの減少方法
Document Type and Number:
Japanese Patent JP6542766
Kind Code:
B2
Abstract:
The present invention relates to a slurry composition for reducing scratches generated when polishing the metal film in a manufacturing process of a semiconductor integrated circuit, by lowering frictional force so that a temperature of the composition which may rise during the polishing is lowered, the thermal stability of the slurry is improved and the size increase of particles in the slurry is suppressed, and a method for reducing scratches using the same. The method comprises the steps of applying a slurry composition for polishing a metal film to a substrate on which the metal film is formed, the slurry composition containing an organic solvent including a nitrogen atom and a glycol-based organic solvent; and making a polishing pad to be contacted to the substrate and moving the polishing pad with respect to the substrate, thereby removing at least part of the metal film from the substrate.
Inventors:
Park Chang Young
Park Jongde
Shin Jong Chul
Kim Jae Hyun
Igfa
Park Min Sung
Park Jongde
Shin Jong Chul
Kim Jae Hyun
Igfa
Park Min Sung
Application Number:
JP2016525905A
Publication Date:
July 10, 2019
Filing Date:
October 21, 2014
Export Citation:
Assignee:
DONGJIN SEMICHEM CO., LTD.
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
| JP2010251778A | ||||
| JP2008118104A | ||||
| JP2012529174A | ||||
| JP2006060205A | ||||
| JP2000252242A |
Foreign References:
| US20030087525 |
Attorney, Agent or Firm:
Kenichi Morita
Kenjiro Yamaguchi
Hironori Nagayama
Yuzaki Ozaki
Kenjiro Yamaguchi
Hironori Nagayama
Yuzaki Ozaki