Title:
METHOD FOR ALIGNING PHOTO-SOLDER RESIST MASK
Document Type and Number:
Japanese Patent JP3404682
Kind Code:
B2
Abstract:
PURPOSE: To provide a photo-solder resist mask aligning method for printed wiring board by which the aligning accuracy of a printing mask with a printed wiring board can be confirmed and corrected before starting exposing work.
CONSTITUTION: Since printed board-side positional accuracy confirming marks 5 are provided at arbitrary positions on a printed wiring board 1 and printing mask-side positional accuracy confirming marks 6 are provided on a printing mask 2 in corresponding to the marks 5, the aligning accuracy of the mask 2 with the board 1 can be confirmed and corrected when the marks 5 and 6 are aligned with each other.
Inventors:
Akira Yonetake
Tsuneya Ishii
Tsuneya Ishii
Application Number:
JP34325193A
Publication Date:
May 12, 2003
Filing Date:
December 17, 1993
Export Citation:
Assignee:
Hitachi Communication Technology Co., Ltd.
International Classes:
G03F9/00; H05K3/00; (IPC1-7): H05K3/00; G03F9/00
Domestic Patent References:
| JP588380A | ||||
| JP468591A | ||||
| JP5232714A |
Attorney, Agent or Firm:
Teruo Aoki
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