Title:
METHOD FOR ALIGNING PROBE CHIP ARRAY OF PROBE CARD TO CORRESPONDING CONTACT PADS, FOR INTEGRATED CIRCUIT PROBING APPLICATION
Document Type and Number:
Japanese Patent JP2015019087
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for aligning a probe chip array of a probe card to corresponding contact pads, for an integrated circuit probing application.SOLUTION: A method for aligning a probe chip array of a probe card to corresponding contact pads, includes the steps of: acquiring an image of a back side of an integrated circuit 200 by using an infrared camera 215; superimposing a mapping of contact pads 202 on the image of the back side; selecting the contact pads 202 as landing points; removing the image of the back side to leave only the selected contact pads 202; acquiring an image of a probe chip array 220; superimposing the image of the probe chip array 220 on the selected contact pads 202; and when a position of the probe chip array 220 do not match positions of the selected contact pads 202, moving the position of the probe chip array 220 so as to match the positions of the selected contact pads 202.
Inventors:
PORTUNE RICHARD ALAN
Application Number:
JP2014166601A
Publication Date:
January 29, 2015
Filing Date:
August 19, 2014
Export Citation:
Assignee:
DCG SYSTEMS INC
International Classes:
H01L21/66; G01R31/28
Domestic Patent References:
| JP2004146428A | 2004-05-20 | |||
| JP2001024042A | 2001-01-26 | |||
| JPS62298128A | 1987-12-25 | |||
| JP2003152037A | 2003-05-23 |
Attorney, Agent or Firm:
Patent business corporation MAEDA PATENT OFFICE
Hiroshi Maeda
Hiroshi Maeda