To provide a method and an apparatus for bonding semiconductor chips capable of high-reliability bonding, without troublesome operation etc., even in the case of narrow-pitched inner leads.

In the case of bonding a group of electrode bumps provided on one principal surface of a semiconductor chip 8 to a group or inner leads 10' corresponding, the inner leads and the electrodes bumps corresponding are positioned collating their positional relationship, and both are joined after that, on the basis of design value co-ordinates of the inner leads and the co-ordinate information of the chip electrodes inputted beforehand. Besides, the above- mentioned bonding apparatus is provided with a memory 14 capable of inputting the co-ordinates of design values of line inner leads 10' and the co-ordinate information of the electrode bumps of the chip 8, and has a stage driving mechanism 7 which co-ordinate-collates the positional relationship of the inner leads 10' and the electrode bumps corresponding, causes X, Y, and θ of a semiconductor chip stage 6 to operate, and positions the inner leads and electrode bumps corresponding, a co-ordinate lighting means 15, and a driving mechanism control system 16 as well.