Title:
METHOD AND APPARATUS FOR CLAMPING SUBSTRATE
Document Type and Number:
Japanese Patent JP3446879
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method and apparatus for clamping a substrate which is capable of accurately clamp a substrate and avoiding friction of guide grooves and breaks of the substrate.
SOLUTION: A vertical clamping step of lifting a backup member 73 to stepwise push a substrate S up, until the substrate S introduced to specified position with its both side edges guided by U-shaped guide grooves 44 abuts the top faces of the guide grooves 44, substrate moving step of repeatedly moving a clamp member 46a reciprocally in the widthwise direction of the substrate S each time of the stepwise pushing operation, and lateral clamping step of moving the clamp member 46a fore in the widthwise direction of the substrate S to finally push the substrate S to the side face of one guide groove 44, are comprised.
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Inventors:
Shigeru Kurihara
Kazuyoshi Ohyama
Katsumi Hirano
Kazuyoshi Ohyama
Katsumi Hirano
Application Number:
JP15680798A
Publication Date:
September 16, 2003
Filing Date:
May 21, 1998
Export Citation:
Assignee:
Hitachi High-Tech Instruments Co., Ltd.
International Classes:
H05K13/04; (IPC1-7): H05K13/04
Domestic Patent References:
| JP983189A |