Title:
METHOD AND APPARATUS FOR SOLDERING PLATE-SHAPED CIRCUIT SUPPORT IN PROTECTIVE GAS SOLDERING APPARATUS
Document Type and Number:
Japanese Patent JPS59191565
Kind Code:
A
Abstract:
The invention concerns preventing oxidation of printed circuit board metal surfaces as a result of heat produced in a solder bath arrangement and reducing thermal stress defects from occurring in the circuit carrier being soldered. An enclosed reaction chamber is provided with the solder bath and supplied with a pressurized atmosphere of inert gas which gas seals the reaction chamber from ambient air. The inert gas is discharged from jets against the solder side (the connector post side) of the printed circuit boards at a point upstream of the solder bath and the inert gas is at a temperature substantially higher than the solder bath temperature.
Inventors:
HAINTSU KURISUTOPUFU
YURUGEN GAMARUSUKII
EDOUARUTO RENTSU
URURITSUHI NOIMAN
RAINHARUTO FUON DERU SHIYUMITS
YURUGEN GAMARUSUKII
EDOUARUTO RENTSU
URURITSUHI NOIMAN
RAINHARUTO FUON DERU SHIYUMITS
Application Number:
JP4829684A
Publication Date:
October 30, 1984
Filing Date:
March 15, 1984
Export Citation:
Assignee:
SIEMENS AG
International Classes:
B23K31/02; B23K1/008; B23K1/08; H05K3/34; (IPC1-7): B23K1/00; B23K1/12
Domestic Patent References:
| JPS579011U | 1982-01-18 | |||
| JPS579010U | 1982-01-18 | |||
| JPS4982969A | 1974-08-09 |
Attorney, Agent or Firm:
Toshio Yano