To provide a method, of cleaning an electrostatic chuck, in which the contaminants on the electrostatic chuck can be removed efficiently and fully.

In the method of cleaning the electrostatic chuck, the electrostatic chuck, which is installed inside a chamber and which attracts and supports a substrate, is cleaned. The method is provided with (1) a plasma etching process, which executes plasma etching process on the electrostatic chuck, (2) a substrate-mounting process in which the substrate is mounted on the electrostatic chuck plasma-etched in the plasma etching process and (3) a substrate carry-out process, in which the substrate mounted on the electrostatic chuck in the substrate mounting process is carried out.