Title:
METHOD FOR CONNECTING CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP3227777
Kind Code:
B2
Abstract:
PURPOSE: To provide the connecting method for the circuit board which can surely connect the main circuit board of a liquid crystal display panel, etc., to semiconductor components and a slave circuit board while preventing electrodes on the same substrate from electrically conducting to one another.
CONSTITUTION: The transparent main circuit board 1 is coated with photosensitive resin 7 with which conductive fine particles 3 are mixed and irradiated with light 8 from behind the main circuit board 1. At this time, the electrode 2 on the main circuit board 1 cuts off light, so the conductive fine particles 3 are removed together with the photosensitive resin 7 except on the electrode 2 by developing the main circuit board 1. Further, the transparent main circuit board 1 is coated with the photosensitive resin 7, which is removed except on the electrodes on the substrate; and the conductive fine particles 3 are charged in the removed parts, so that the conductive fine particles 3 are arranged only at the electrode parts.
Inventors:
Hideaki Ohtsuki
Toshio Kato
Yoko Mifuku
Fumio Matsukawa
Toshio Kato
Yoko Mifuku
Fumio Matsukawa
Application Number:
JP12047992A
Publication Date:
November 12, 2001
Filing Date:
May 13, 1992
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
G02F1/1345; H01L21/60; H01R43/00; H05K3/32; H05K3/36; (IPC1-7): G02F1/1345; H05K3/32
Domestic Patent References:
| JP639130A | ||||
| JP3119737A | ||||
| JP3236248A | ||||
| JP3131089A | ||||
| JP254827A | ||||
| JP536755A |
Attorney, Agent or Firm:
Kaneo Miyata (1 person outside)