To quickly carry out angle adjustment of a cutter blade for changing/adjusting a crossing angle of the cutter blade to a surface of a semiconductor wafer in the wafer diameter direction in a method for cutting out a protective tape stuck to the surface of the semiconductor along an outer shape of the wafer by travelling the cutter blade along the periphery of the semiconductor wafer.

The angle of the cutter blade 12 is changed around a cutting site where a blade edge of the cutter blade 12 gets in contact with the protective tape T.