Title:
METHOD AND DEVICE FOR EXTRUSION MOLDING UTILIZING ULTRASONIC WAVE
Document Type and Number:
Japanese Patent JP3444791
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for extrusion molding utilizing ultrasonic wave in which such a resin film product can be produced that the same has wide width and precision and free from unevennesses on the surface.
SOLUTION: In the method for extrusion molding utilizing ultrasonic wave, an ultrasonic vibration driving fitting part is equipped with an ultrasonic lip part 7 tilted at about 45 degrees for the direction of resin flow. An extrusion die 5 consists of structure in which a horizontal hole ranging over the whole width of the die is provided in the position of about 1/2 wavelength of ultrasonic resonance from an outlet part 8 of resin. Uniform ultrasonic vibration free from a node along the direction of resin flow is given to the whole width of the die in the vicinity of the tip of an outlet of resin in the extrusion die 5 by means of both a plurality of ultrasonic vibrators 2 driven through an adiabatic vibrator such as a joint-debooster 4 and an oscillator 1 for drive.
Inventors:
Fumiaki Matsunaga
Sadayuki Ueha
Yoshikazu Koike
Sadayuki Ueha
Yoshikazu Koike
Application Number:
JP22549498A
Publication Date:
September 08, 2003
Filing Date:
August 10, 1998
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
B29C47/08; B29C48/30; B29L7/00; (IPC1-7): B29C47/12; B29C47/08
Domestic Patent References:
| JP2141222A | ||||
| JP524559A | ||||
| JP428522A | ||||
| JP3215016A | ||||
| JP847960A |