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Title:
自己整合コンタクトを形成する方法およびデバイス構造体
Document Type and Number:
Japanese Patent JP7157134
Kind Code:
B2
Abstract:
Techniques for forming self-aligned contacts by forming gate sidewall spacers and gates before forming the contacts are provided. In one aspect, a method of forming self-aligned contacts includes the steps of: forming multiple gate sidewall spacers on a substrate; burying the gate sidewall spacers in a dielectric; forming gate trenches by selectively removing the dielectric from regions between the gate sidewall spacers in which gates will be formed; forming the gates in the gate trenches; forming contact trenches by selectively removing the dielectric from regions between the gate sidewall spacers in which the self-aligned contacts will be formed; and forming the self-aligned contacts in the contact trenches. A device structure having self-aligned contacts is also provided.

Inventors:
Fan, suchen
Planata Siharan, Ballas Bramanian
Green, Andrew
Cie, Louis Ron
Raymond, Mark, Victor
Lian, cyan
Application Number:
JP2020502130A
Publication Date:
October 19, 2022
Filing Date:
July 16, 2018
Export Citation:
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Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION
International Classes:
H01L21/336; H01L21/28; H01L29/417; H01L29/423; H01L29/49; H01L29/78; H01L29/786
Domestic Patent References:
JP2004152790A
JP2001291867A
JP2002170953A
JP2001267561A
JP2009130035A
Foreign References:
US9520482
US20010055842
CN1319881A
US20160365424
US20020068394
KR20020043444A
Attorney, Agent or Firm:
Tadashi Taneichi