To provide a method of forming a semiconductor device concurrently including position information in an exposure shot by a stepper lithographic machine and exposure shot position information for a GaAs semiconductor wafer on each chip on the wafer.

A semiconductor chip 11 includes an element formation region 12 and a chip position identification pattern 13 outside the region 12, and the pattern 13 consists of the position information in an exposure shot 14 and the exposure shot position information 15. The information 14 indicates positions of a plurality of chip patterns in a reticle to be used in stepper lithography. The exposure shot position information indicates positions of exposure shots repeated across the semiconductor wafer. By indicating the two pieces of the information in the chip identification pattern 13, the chip can be identified as a what-numbered chip in a what-numbered shot.