METHOD OF INSERTING WIRE BY WIRE BONDING DEVICE

Title:

METHOD OF INSERTING WIRE BY WIRE BONDING DEVICE

Document Type and Number:

Japanese Patent JPH0621614

Kind Code:

A

Abstract:

PURPOSE: To improve the productivity by automatically inserting a wire into a groove, concerning the wire insertion method by a wire bonding device for inserting a wire into the groove or the wire guide arranged on a printed board.

CONSTITUTION: A wire 4 is shifted to above a groove 6 and is pressed, being hooked with wire hookers 2 and 2a, whereby it is bent to be in the same direction as the wire insertion part of a wire guide 3. The wire 4 is inserted in a groove 6, being pressed with wire hooks 2 and 2a and lowered in Z1 direction. The wire hooks 2 and 2a are separated from the wire 4.

More Like This:

WO/2017/162331	PLASTIC COMPONENT HAVING AT LEAST ONE ELECTRICAL CONDUCTOR TRACK AND METHOD FOR THE PRODUCTION THEREOF
JPH02143487	PRINTED WIRING BOARD WITH INJECTION MOLDED BOARD
WO/2019/203050	WIRING CORRECTION DEVICE AND WIRING CORRECTION METHOD

Inventors:

OIKAWA KOICHI
KOMORIYA HITOSHI
YABUKI AKIHIKO

Application Number:

JP17712192A

Publication Date:

January 28, 1994

Filing Date:

July 03, 1992

Export Citation:

Click for automatic bibliography generation Help

Assignee:

FUJITSU LTD

International Classes:

H05K3/10; (IPC1-7): H05K3/10

Attorney, Agent or Firm:

Tadahiko Ito

Next Patent: MANUFACTURE OF FILM SUBSTRATE